Communication ICs | IT Corporate

Published: Sep 29, 2023

Enabling the Migration to Software-Defined Platforms for Critical Infrastructure

Embedded systems used in critical infrastructure are currently undergoing a dramatic evolution. Historically, they had varying levels of network connectivity,...

NXP’s Mini Logic portfolio

When first introduced, logic product offerings consisted of quad, hex and octal standard logic gates, inverters and buffers. As integration and miniaturization...

LGA80D Digital DC-DC Converter Module

The LGA80D from Artesyn Embedded Technologies is the first DC-DC converter module of its kind on the market. This innovative non-isolated unit offers two...

The Sine Amplitude Converter Topology Provides Superior Efficiency and Power Density in Intermediate Bus Architecture Applications

The Sine Amplitude Converter topology is the dynamic, high- performance engine at the heart of Vicor's new VI Brick Bus Converter products. ...

Published: Aug 17, 2023

Causes and Consequences of IT and OT Convergence

Until recently, operational technology (OT) and information technology (IT) had completely different purposes and were on separate, independent networks....

eGaN® FETs in High Frequency Resonant Converters

In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously, the advantages provided by eGaN FETs in hard switching...

FULL RF SIGNAL CHAINS FROM 0 Hz TO 110 GHz

This white paper provides examples of the wider frequency spectrum covered by ADI, and explains that true dc is important. Off signal chain performance...

Top 5 Applications for Inductive Sensors on Packaging Machines

Amid the multitude of advanced technologies being integrated into automated packaging operations today, one of the most reliable and versatile components...

HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS

Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial markets. It offers Full DRAM technology portfolio...

ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS

This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced bubble ejection process in which small vapor bubbles...

Powering your FPGA Applications

Field-programmable gate arrays (FPGAs) have gained much attention and widespread application in the end market. This document outlines the requirements...

IMPLEMENTING PCI EXPRESS BRIDGING SOLUTIONS IN AN FPGA

Like its predecessor, the Peripheral Component Interconnect (PCI), PCI Express is becoming a ubiquitous system interface. Unlike PCI, PCI Express adopts...

Leakage Currents in the Right Perspective

Trade-off between best attenuation effectiveness and minimum leakage current. Network filters (EMC filters) are often regarded as a Blackbox and,...

8 Most Common Level Sensing Methods: A Guide for Reliable & Cost-effective Applications

Level sensors have been a part of manufacturing processes for several decades, in industries as diverse as food and beverage, semiconductors, and pharmaceutical....

Semiconductors / Communication ICs

Enabling the Migration to Software-Defined Platforms for Critical Infrastructure

NXP’s Mini Logic portfolio

LGA80D Digital DC-DC Converter Module

The Sine Amplitude Converter Topology Provides Superior Efficiency and Power Density in Intermediate Bus Architecture Applications

Causes and Consequences of IT and OT Convergence

eGaN® FETs in High Frequency Resonant Converters

FULL RF SIGNAL CHAINS FROM 0 Hz TO 110 GHz

Top 5 Applications for Inductive Sensors on Packaging Machines

HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS

ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS

Powering your FPGA Applications

IMPLEMENTING PCI EXPRESS BRIDGING SOLUTIONS IN AN FPGA

Leakage Currents in the Right Perspective

8 Most Common Level Sensing Methods: A Guide for Reliable & Cost-effective Applications

More Semiconductors Topics

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