Audio ICs | IT Corporate

Published: Jul 01, 2022

Smoothing The Way To Vehicle Autonomy: Essential Hardware Components At Level 3 And Higher

In the grand scheme of advanced driver assistance systems (ADAS) and autonomous implementation, replacing a driver requires many hardware and software...

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Published: Jun 29, 2022

Top Motor Braking Trends In The Automotive Industry

Brakes are some of the most crucial safety components in automobiles. Used to slow a vehicle’s momentum before parking and avoid collisions and accidents,...

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HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS

Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial markets. It offers Full DRAM technology portfolio...

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Published: Apr 01, 2021

Solution Flyer: RFIC Characterization

Automating Sub-mmWave Front-End Module, Transceiver, and Modem Test. As development schedules shrink under time-to-market pressures and product complexity...

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Published: Apr 05, 2021

Engineer’s Guide to 5G Semiconductor Test

This Whitpaper paper focuses on the new challenges of testing semiconductor devices for wideband 5G applications.The enhanced mobile...

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SOLVING INTELLIGENCE, VISION & CONNECTIVITY CHALLENGES AT THE EDGE WITH ECP5™ FPGAs

This whitepaper will introduce the ECP5™ and LatticeECP3™ FPGAs as viable solutions to overcome embedded design co-processing and connectivity...

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RS-485 Transceiver Tutorial

This in-depth white paper guides you through the choices and weighs key design considerations to help you pick the right transceiver. It reviews the most...

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Material Advances Enable New Generation of Power Inductors

Designers building power inductors for today’s highly volume mobile markets face a difficult dilemma. On the one hand the market demands higher performance...

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Evolution of Weatherproofing Solutions for the Cell Site

Weatherproofing options for coaxial connections at cell sites have changed and expanded along with the cell sites themselves. Today’s more complex...

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Wide VIN power management ICs simplify design, reduce BOM cost, and enhance reliability

High-voltage power management ICs, such as TI’s LM5000 series of integrated controllers and regulators, can simplify the design of high-voltage power...

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Robotics

Advances in semiconductor technologies from efficient power semiconductors to advanced sensor systems, has lead to the development of intelligent and safe...

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Pre-tested System-on-Chip Design Accelerates PLD Development

Many moderate size Programmable Logic Device (PLD) designs, especially those in control plane applications, consist of a number of interfaces interconnected...

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ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS

This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced bubble ejection process in which small vapor bubbles...

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NEW APPROACHES TO HARDWARE ACCELERATION USING ULTRA LOW DENSITY FPGAs

Ask system designers to list the problems they face – it doesn’t matter whether they’re building mobile consumer, automotive, industrial,...

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