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TDK Invensense

Wafer Level Packaging of MOEMS Solves Manufacturability Challenges In Optical Cross Connect

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This paper will examine the key packaging challenges in the fabrication of a 1000x1000 OXC, using MOEMS (micro-optical-electromechanical-systems) mirrors in 2N configurations. It will describe how wafer-scale-integration (WSI) allowed for much greater simplification of the overall system and creation of the first...

Published: Jul 19, 2018
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Advanced Linear Devices Inc

New Design Concepts in Ultra Low Voltage and Nanopower Circuits with EPAD MOSFET Arrays

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This introduction to EPAD MOSFET describes a broad selection of devices with precisely set gate threshold voltage values, including zero threshold made, enhancement mode and depletion mode. Furthermore, novel circuit designs are presented to illustrate how these devices can be used at a practical level. The brief circuit...

Published: Jul 18, 2018
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Teledyne e2v

Ultra-Low Dark Signal in the AIMO CCD230-84

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CCDs are ideal for very low light imaging applications, such as astronomy, clinical diagnostic testing, and bioluminescence. The compatibility of the CCD with very long integration times, and facility for noiseless on-chip charge binning, makes it a very sensitive imager. It remains very competitive for certain applications...

Published: Jul 26, 2018
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GE Power

GROUND FAULT DETECTION IN MULTIPLE SOURCE SOLIDLY GROUNDED SYSTEMS VIA THE SINGLE-PROCESSOR CONCEPT FOR CIRCUIT PROTECTION

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Modern power distribution systems often contain multiple power sources integrated within one system. A simple variant may be the common double-ended substation, which can be further complicated by additional emergency or alternate sources. This presents significant complexity to the designer attempting to design a protection...

Published: Jul 24, 2018
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National Instruments

Practical Guide to Maximizing DC Measurement Performance

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This guide will begin by reviewing instrument fundamentals, learning how to use SMUs, and examining the features that can help you set up your instrument. Then go over the key best practices you can apply to your test setup to mitigate various errors seen when taking DC measurements.  This guide explores these...

Published: Nov 04, 2019
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Littelfuse

Arc-Flash Protection Key Considerations for selecting an Arc-Flash Relay

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Arc-Flash Relays are an effective defense against dangerous Arc-Flash events, and the decision to include such a relay in a design is an easy one. Less easy, however, is selecting the optimal relay for an application.  Download this whitepaper to find out more.

Published: Jul 16, 2018
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Phoenix Contact

Maximizing monitoring: Three key ways to improve profitability

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The goals of this technical brief are to introduce the three basic ways monitoring can help achieve savings. It will conclude with some insight on system scaling and a few applications where monitoring saved customers money – these application examples are real-world solutions implemented by Phoenix Contact customers....

Published: Jul 17, 2018
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Cypress Semiconductor

Data-Logging Memory Challenges in the 21st Century

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As factory automation systems become more intelligent they will move data acquisition, storage and processing out to the edge of the network, enabling real-time machine controls and management. Factories will be smarter and more connected. These “edge nodes” will predict, then prevent failures before they occur...

Published: Nov 07, 2018
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Portescap

EFFICIENCY FOR LIFE Advanced miniature motor design for medical ventilation

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The roots of positive airways mechanical ventilation can be traced to WWII with the needs for pilots to breath at higher altitudes. Ventilation therapy then made accelerated progresses during the polio epidemic in the 50’s. Today, mechanical ventilation is indicated when a patient's spontaneous ventilation...

Published: Jul 20, 2018
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Kester Inc

Case Study on the Validation of SAC305 and SnCu Based Solders in SMT, Wave and Hand-soldering at the Contract Assembler Level

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In recent years tin-copper based solders with a variety of elemental additives have emerged which improve the overall properties and performance of tin-copper solders. This paper is a summary of the experience at a medium sized assembler in achieving the customer driven mandate to go lead-free and the maintenance...

Published: Jul 25, 2018
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TDK Invensense

Motion Processing: The Next Breakthrough Function in Handsets

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Motion processing is emerging as the only solution that can deliver a new user interface and experience that will make a specific mobile handset stand out.  There is a need for full, six degrees of freedom (6-DoF) motion processing that can precisely translate human motion for the various applications. ...

Published: Jul 19, 2018
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LEMO INC.

Electronic Connector Counterfeits and Copies

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Knock-offs of electronic components, such as connectors, can cause big problems for purchasers, particularly if the purchasers are inaccurately informed as to what they are buying.  We at LEMO provide this white paper to help our customers make more informed decisions and better shield themselves from civil and...

Published: Jul 16, 2018
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XP Power

Peaks and Valleys

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Some power supplies specify a peak load capability to support loads that are higher than the nominal continuous power for short periods. In these applications the average power required is typically significantly lower than the peak demand. Applications that require high peak currents include print heads, pumps, motors,...

Published: Jul 23, 2018
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ITT Interconnect Solutions

New PHD Technology Yields Higher Density, Lower Optical Loss Interconnect Solutions

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Current fiber optic technology fails to deliver a High Performance Interconnect solution which provides service and manufacturability, high density channel count, low loss optical performance and high reliability.  New broadband service networks, high fiber densities, increasing end - user bandwidth demands and...

Published: Jul 25, 2018
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